TYAN 解決方案

FT48‐B7055

4U/ 2S Xeon®/ (4) PCI‐E G3 x16/ (8) 3.5” HDDs/ (2+1) RPSU

GPU‐focused DP SNB‐EP platform w/ 4x PCI‐E Gen.3 x16 slots and optional 2x 10GbE LOM
Dimension: H176mm x W425mm x D698.5mm
Intel® Xeon® E5‐2600 CPU w/ TDP up to 150W
Chipset

Intel® C602 PCH (PBG‐A)
Option ROM kit for SAS 3G enabling (‐W SKU)

Memory

(4+4) DDR‐III DIMM slots (w/ 4x memory channels per CPU)
Supporting up to 256GB LRDIMM 1333/1066 memory
Supporting up to 128GB R‐DDR3 1600/1333/1066/800 memory
Supporting up to 64GB U‐DDR3 1333/1066 memory

PCI Expansion Slots

(4) FH/FL PCI‐E G3 x16 slots (#7, #5, #3, #1)
(2) FH/FL PCI‐E G3 x8 slots (#8, #4) (#8 is only available on –B SKU)
(1) FH/FL PCI 32/33MHz slot (#2)

Network

(3) GbE ports (Intel® I350‐BT2 + Intel® 82574L)
(2) 10GbE + (1) GbE ports (Intel® X540‐AT2 + Intel® 82574L) (‐2T SKU)

Storage
(8) hot‐swap 3.5” SAS/SATA 3G HDDs (Intel® RSTe 3.0 RAID)
AST2300 iBMC w/ iKVM (IPMI v2.0 compliant)
(2+1) 1,540W hot‐swap RPSU @ 220Vac, 80+ Gold
(5+1) 12038 hot‐swap RFAN

FT72‐B7015

4U/ 2S Xeon®/ (8) PCI‐E G2 x16/ (2) 2.5” HDDs/ (2+1) RPSU

GPU‐focused DP WSM‐EP platform w/ highest memory footprint & 8x PCI‐E Gen.2 x16 slots
Dimension: H176mm x W438mm x D710mm
Intel® Xeon® 5600 CPU w/ TDP up to 130W
Chipset

Intel® 5520 + 5520 + ICH10R (TBG‐36D)
(4) PLX PEX8647 48‐lane, 3‐port PCI‐E Gen.2 switches

Memory

(9+9) DDR‐III DIMM slots (w/ 3x memory channels per CPU)
Supporting up to 144GB R‐DDR3 1600/1333/1066/800 memory
Supporting up to 48GB U‐DDR3 1333/1066 memory

PCI Expansion Slots

(8) FH/FL PCI‐E G2 x16 slots (#15, #13, #11, #9, #7, #5, #3, #1)
(2) FH/FL PCI‐E G2 x16 slots (w/ x4 link) (#12, #4)

(2) FH/FL PCI‐E G2 x1 slots (#10, #8)
(1) FH/FL PCI 32/33MHz slot (#14)

Network

(4) GbE ports (4x Intel® 82574L)

Storage
(2) internal 3.5”/2.5” SATA 3G HDDs (Intel® Matrix RAID)
AST2050 iBMC w/ iKVM (IPMI v2.0 compliant)
(2+1) 2,400W hot‐swap RPSU @ 220Vac, 80+ Silver
(3) 12038 FAN

FT77‐B7015

2S Xeon®/ (8) PCI‐E G2 x16/ (2) 2.5” HDDs/ (2+1) RPSU/ RFAN

GPU‐focused DP WSM‐EP platform w/ highest memory footprint & 8x PCI‐E Gen.2 x16 slots
Dimension: H176mm x W438mm x D770mm
Intel® Xeon® 5600 CPU w/ TDP up to 130W
Chipset

Intel® 5520 + 5520 + ICH10R (TBG‐36D)

(4) PLX PEX8647 48‐lane, 3‐port PCI‐E Gen.2 switches

Memory

(9+9) DDR‐III DIMM slots (w/ 3x memory channels per CPU)

Supporting up to 144GB R‐DDR3 1600/1333/1066/800 memory

Supporting up to 48GB U‐DDR3 1333/1066 memory

PCI Expansion Slots

(8) FH/FL PCI‐E G2 x16 slots (#15, #13, #11, #9, #7, #5, #3, #1)

(2) FH/FL PCI‐E G2 x16 slots (w/ x4 link) (#12, #4)

(2) FH/FL PCI‐E G2 x1 slots (#10, #8)

(1) FH/FL PCI 32/33MHz slot (#14)

Network

(4) GbE ports (4x Intel® 82574L)

Storage

(4) internal 2.5” SATA 3G HDDs (Intel® Matrix RAID)

AST2050 iBMC w/ iKVM (IPMI v2.0 compliant)
(2+1) 2,400W hot‐swap RPSU @ 220Vac, 80+ Silver
(5+1) 12038 hot‐swap RFAN

FT77A‐B7059

4U/ 2S Xeon®/ (8) PCI‐E G3 x16/ (6) 2.5” HDDs/ (2+1) RPSU/ RFAN

GPU‐focused DP SNB‐EP platform w/ highest memory footprint & 8x PCI‐E Gen.3 x16 slots
Dimension: H176mm x W438mm x D770mm
Intel® Xeon® E5‐2600 CPU w/ TDP up to 150W
Chipset
Intel® C602 PCH (PBG‐A)
Memory
(12+12) DDR‐III DIMM slots (w/ 4x memory channels per CPU)
Supporting up to 768GB LRDIMM 1333/1066 memory
Supporting up to 384GB R‐DDR3 1600/1333/1066/800 memory
Supporting up to 192GB U‐DDR3 1333/1066 memory*
* No 1.35V UDIMM support for3DPC deployment (Intel POR)
PCI Expansion Slots
(8) FH/FL PCI‐E G3 x16 slots (#15, #13, #11, #9, #7, #5, #3, #1)
(2) FH/FL PCI‐E G3 x8 slots (#8, mezzanine)
(3) FH/FL PCI‐E G2 x1 slots (#10, #6, #2)
(1) FH/FL PCI 32/33MHz slot (#4)
Network
(2) GbE ports (Intel® I350‐AM2)
Storage
(2) SATA 6G + (4) SATA 3G (AHCI) w/ Intel® RSTe 3.0 RAID support
AST2300 iBMC w/ iKVM (IPMI v2.0 compliant)
(2+1) 2,400W hot‐swap RPSU @ 220Vac, 80+ Platinum
(5+1) 12038 hot‐swap RFAN

GN70-B7056

Specifications

System	Form Factor		2U Rackmount
	Gross Weight		25 kg
	Chassis Model		GN70
	Dimension (D x W x H)		27.56" x 17.72" x 3.43" (700 x 450 x 87mm)
	Motherboard		S7056GM3NR
	Board Dimension		EATX, 12"x13" (305x330mm)
Front Panel	Buttons		(1) RST / (1) ID / (1) PWR w/ LED
	LEDs		(1) PWR / (1) ID / (1) Warning / (3) LAN
	I/O Ports		(2) USB ports
External Drive Bay	Type / Q'ty		2.5" or 3.5" Hot-Swap / (8)
	HDD backplane support		SAS / SATA 6.0Gb/s
System Cooling Configuration	FAN		(4) 6cm fans
Power Supply	Type		ERP1U
	Efficiency		80 plus gold
	Redundancy		1+1
	Serviceability		Hot-swap
	Input Range		Full-range AC(100-240V)
	Frequency		50/60 Hertz
	Output Watts		770 Watts
Processor	Supported CPU Series		Intel Xeon Processor E5-2600 Series
	Socket Type / Q'ty		(2) LGA2011
	Thermal Design Power (TDP) wattage		Max up to 130W
	System Bus		Up to 4.8/ 5.86/ 6.4GT/s with Intel QuickPath Interconnect (QPI) support
Chipset	PCH		Intel C602
	Super I/O		Nuvoton 83773G
Memory	Supported DIMM Qty		(8)+(8) DIMM slots
	DIMM Type / Speed		DDR3/DDR3L 800 / 1066 / 1333 / 1600 RDIMM, 800 / 1066 / 1333 UDIMM / LRDIMM
	Capacity		up to 128GB UDIMM / 256GB RDIMM / 512GB LRDIMM
	Memory channel		4 Channels per CPU / Support 2 R/LR-DIMMs or 2 UDIMMs per channel
Expansion Slots	PCI-E		(2) sets of the following expansion combination: / (1) PCI-E x16 slot (w/x16 or x8 link) + (1) PCI-E x8 slot (w/x0 or x8 link) + (1) PCI-E x8 slot
	Recommended TYAN Riser Card		M7056-L24-3F, PCI-E x16 2U riser card (left) / M7056-R24-3F, PCI-E x16 2U riser card (right)
LAN	Port Q'ty		(3) GbE ports
	Controller		Intel 82574L / Intel I350-BT2
Graphic	Connector type		D-Sub 15-pin
	Resolution		Up to 1920x1200
	Chipset		Aspeed AST2300
I/O Ports	USB		(4) ports (2 at front, 2 at rear)
	COM		(1) DB-9 COM port
	VGA		(1) D-Sub 15-pin port
	RJ-45		(3) ports
System Monitoring	Chipset		Nuvoton 83773G
	Voltage		Monitors voltage for CPU, memory, chipset & power supply
	Temperature		Monitors temperature for CPU & system environment
	LED		Over temperature warning indicator / Fan & PSU fail LED indicator
	Others		Chassis intrusion detection / Watchdog timer support
Server Management	Onboard Chipset		Onboard Aspeed AST2300
	AST2300 IPMI Feature		IPMI 2.0 compliant baseboard management controller (BMC) / Supports storage over IP and remote platform-flash / USB 2.0 virtual hub
	AST2300 iKVM Feature		24-bit high quality video compression / 10/100 Mb/s MAC interface
BIOS	Brand / ROM size		AMI / 8MB
	Feature		Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3 /PXE boot / ACPI 2.0 power management /Power on mode after power recovery / User-configurable H/W monitoring / Auto-configurable of hard disk types
Operating System	OS supported list		Please refer to our OS supported list.
Regulation	FCC (DoC)		Class A
	CE (DoC)		Yes
Operating Environment	Operating Temp.		10° C ~ 35° C (50° F~ 95° F)
	Non-operating Temp.		- 40° C ~ 70° C (-40° F ~ 158° F)
	In/Non-operating Humidity		90%, non-condensing at 35° C
RoHS	RoHS 6/6 Compliant		Yes
Package Contains	Barebone		(1) GN70B7056 Barebone
	Heatsink / Cooler		(2) LGA2011 CPU heatsinks
	Rail kit		(1) sliding rail kit
	Manual		(1) MB User's manual + (1) BB User's manual
	Installation CD		(1) TYAN installation CD
	Cable	Power Cord	(2) CCBL-0300, EU type power cord / (2) CCBL-0317, US type power cords

GN70‐B8236‐HE

2U/ 2S Opteron™/ (2) PCI‐E G3 x16/ (8) 3.5” HDDs

2U‐optimized DP G34 platform w/ 2x PCI‐E Gen.3 x16 slots for both CPU‐centric and GPU‐centric applications
Dimension: H87mm x W430mm x D700mm
AMD Opteron™ 6200 CPU w/ TDP up to 115W
Chipset

AMD SR5690 + SR5690 + SP5100

LSI SAS2008 SAS 6G controller

Memory

(8+8) DDR‐III DIMM slots (w/ 4x memory channels per CPU)

Supporting up to 256GB R‐DDR3 1600/1333/1066/800 memory

Supporting up to 128GB U‐DDR3 1333/1066 memory

PCI Expansion Slots

(2) FH/FL PCI‐E G3 x16 slots

(2) FH/HL PCI‐E G3 x8 slots

Network

(3) GbE ports (Intel® 82576EB + Intel® 82574L)

Storage
(8) hot‐swap 3.5” SAS 3G HDDs (LSI integrated RAID)
AST2050 iBMC w/ iKVM (IPMI v2.0 compliant)
1,540W aggregated by (2) 770W PSUs, 80+ Gold
(8) 6038 hot‐swap FAN (for GPU deployment)

GT26A-B8812

1U/ 4S Opteron™/ (4) 2.5” HDDs/ (1) PCI-E slot
1U QP G34 platform for high-density, CPU-centric HPC applications
Dimension: H43.6mm x W436mm x D708mm
AMD Opteron™ 6200 CPU w/ TDP up to 115W
Chipset

AMD SR5690 + SP5100
LSI SAS2008 SAS 6G controller

Memory

(8+8+8+8) DDR-III DIMM slots (w/ 4x memory channels per CPU)
Supporting up to 512GB R-DDR3 1600/1333/1066/800 memory

PCI Expansion Slots

(1) HH/HL PCI-E G2 x16 slot (#4)

Network

(3) GbE ports (Intel® 82576EB + Intel® 82574L)

Storage

(4) 2.5” SAS 6G HDDs (LSI RAID 0/1/1E/10)

AST2050 iBMC w/ iKVM (IPMI v2.0 compliant)
(1) 1,200W front-serviced, cold-swap PSU, 80+ Platinum
(6) 4056 easy-swap FANs

TA77‐B7061 (Socket R)

2U/ 2S Xeon®/ (4) PCI‐E G3 x16/ (8) 2.5” HDDs/ (1+1) RPSU

GPU‐focused DP SNB‐EP platform w/ 4x PCI‐E Gen.3 x16 slots within 2U form factor
Dimension: H87mm x W436mm x D770mm
Intel® Xeon® E5‐2600 CPU w/ TDP up to 135W
Chipset

Intel® C602 PCH (PBG‐A)

Option ROM kit for SAS 3G enabling (‐W SKU)

Memory

(8+8) DDR‐III DIMM slots (w/ 4x memory channels per CPU)

Supporting up to 512GB LRDIMM 1333/1066 memory

Supporting up to 256GB R‐DDR3 1600/1333/1066/800 memory

Supporting up to 128GB U‐DDR3 1333/1066 memory

PCI Expansion Slots

(4) FH/FL PCI‐E G3 x16 slots

(1) FH/HL PCI‐E G3 x8 slot

Network

(2) GbE ports (Intel® I350‐AM2) + (1) IPMI

Storage
(8) hot‐swap 2.5” SAS/SATA 3G HDDs (Intel® RSTe 3.0 RAID)
AST2300 iBMC w/ iKVM (IPMI v2.0 compliant)
(1+1) 1,600W hot‐swap RPSU @ 220Vac, 80+ Platinum
(4) 8038 easy‐swap FAN

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